One Of The High Level Material Silicon Magnesium

In order to reduce the manufacturing cost of artificial boards and improve the processing utilization rate of bamboo materials, silicon-magnesium cement bamboo particleboard was prepared by hot pressing process with bamboo shavings and homemade inorganic adhesive as raw materials. With the increase of adhesive amount, the increase of hot pressing temperature and the extension of hot pressing time, the static bending strength and elastic modulus of the board first increased and then decreased, the internal bonding strength gradually increased, and the 24h water absorption thickness expansion rate gradually decreased; with the increase of board density, the static bending strength, elastic modulus and internal bonding strength of silicon-magnesium cement bamboo particleboard gradually increased, and the 24h water absorption thickness expansion rate gradually decreased.

1.A zinc-aluminum-silicon-magnesium-molybdenum hot-dip alloy comprises 25-40wt% Al, 0.3-1.8wt% Si, 0.05-1.8wt% Mg, 0.005-0.1wt% Mo, and the balance is Zn and inevitable impurities of the zinc alloy. The hot-dip alloy structure presents a "田"-shaped short-axis crystal, the alloy grain size is 5-12μm, the primary ηZn phase accounts for less than 20%, and the amount of eutectic structure and eutectoid structure reaches more than 70%. The hot-dip alloy of the present invention can not only improve fluidity, reduce the thickness of the coating, and reduce the cost of galvanizing, but also eliminate the color difference of the coating, make the coating bright and clean, and at the same time significantly improve the scratch resistance and recrystallization resistance, and has excellent application prospects.

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