Products Description
A simple processing method, through hand selection, machine selection, batching, smelting and other processes, the use of patented technology, the use of power frequency furnace, with patented synthetic flux, from the industrial silicon slag to refine elemental silicon, the product to achieve industrial silicon precision, refining method is simple, low cost, is a new technology of energy conservation and emission reduction in the silicon industry.
Products parameters
| Type | Chemical Composition (%) | ||||
| Si | Al | S | P | C | |
| ≤ | |||||
| Silicon Slag 35-38 | 35-38 | 5 | 0.1 | 0.05 | 5 |
| Silicon Slag 38-42 | 38-42 | 5 | 0.1 | 0.05 | 5 |
| Silicon Slag 42-47 | 42-47 | 5 | 0.1 | 0.05 | 5 |
| Silicon Slag 50-55 | 50-55 | 5 | 0.1 | 0.05 | 5 |
| Silicon Slag 55-60 | 55-60 | 5 | 0.1 | 0.05 | 5 |
| Silicon Slag 60-65 | 60-65 | 5 | 0.1 | 0.05 | 5 |
| Size | 10-50mm 90% min/10-70mm 90% min /10-100mm 90% min | ||||
Products cooperation picture

1.The edge removal method involving the improvement of silicon slag and self-doping after the epitaxy of the substrate is carried out when the LTO back sealing layer is removed, and the chamfering parameter is set to within 300μm. Then HF corrosion is carried out, the volume of HF corrosion liquid is 40% ~ 50% of the volume X of the conventional edge removal corrosion liquid in the industry, and the corrosion time is 70% ~ 80% of the industry conventional edge removal corrosion liquid time Y. It is very innovative and practical to find a method to improve the silica slag and self-doping after the epitaxy of the substrate.
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