Products Description
The research and development of an intelligent, systematic, miniaturized and multi-functional welding pressure measurement and control system has enabled it to have the functions of high precision, multi-parameter setting, high sensitivity, and friendly user interface, and complete the control of the welding process of the ultrasonic aluminum wire bonder of IC packaging equipment. According to the principle of ultrasonic welding process and the signal characteristics of process parameters, an intelligent welding pressure measurement and control system was designed. The system processing and control core use TMS320LF2407A chip, and the combination of hardware and software is used to realize the amplification of analog signals.
Products parameters
| Name | Aluminum wire |
| The material | Aluminum alloy |
| The purity | 99.9% |
| Use | Vacuum coating |
| The diameter of | 0.6mm 0.8mm 1.0mm 1.2mm 1.5mm |
Products cooperation picture
1.The pressure jaw device of a power semiconductor ultrasonic aluminum wire bonding machine comprises an upper base and a lower base, the upper base and the lower base are fixedly installed through bolts, a welding window is formed in the middle part of the upper base, a fastening groove is formed in the upper surface of the upper base, a pressure jaw mechanism is arranged on the upper surface of the upper base, a groove is formed at the bottom of the lower base, a positioning hole is formed at the bottom of the lower base, and the fastening groove runs through the upper base to the top of the groove. The pressure jaw device of the power semiconductor ultrasonic aluminum wire bonding machine adopts the pressure jaw seat and the base separation structure, the system structure is simple, the structure is reliable, the versatility is strong, and the same set of structure can be matched with a variety of products for production, which effectively reduces the trial cost and improves the flexibility of field application.
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