One Of High Level Metals Aluminum Wire

Through the analysis and comparison of the mechanical properties and electrical, thermal and chemical oxidation properties of pure copper, copper wire has good mechanical, electrical and thermal properties in chip wire bonding, and it can reduce the soldering spacing and improve the chip frequency and reliability by replacing gold wire and aluminum wire. However, copper is less solderable due to surface oxidation, and a soldering process can be used to improve its solderability.

1.Preparation of hot type continuous casting equipment aluminum wire material can be used to study the influence of process parameters such as mold temperature and drawing casting speed on the surface quality, microstructure and mechanical properties of the material, and observe and analyze the fracture morphology of the ingot prepared under the best process conditions, when the casting temperature is 675~685 °C and the drawing casting speed is 90~120 mm/min, the ingot with better surface quality can be prepared; At the same time, the process parameters will have a certain influence on the preferred orientation of the crystal, when the casting temperature and drawing speed are 680°C and 90 mm/min, respectively, the orientation of the crystal tends to grow in the ?100 direction, and the higher the molding temperature, the better the mechanical properties of the ingot. When the drawing casting speed is 90 mm/min, the prepared hot-type continuous casting aluminum wire has the best plastic processing ability. Compared with ordinary polycrystalline aluminum wire, hot-type continuous casting aluminum wire has better plasticity.

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